Mobile Memory Initiative

Squeezing big performance into tiny packages
System-in-Package (SiP) technology stacks a number of integrated circuits - such as a media processor, DRAM, and Flash memory device - in a single package or module. SiP allows designers to achieve high functionality in a very compact space making it ideal for mobile phones. Though it offers great benefits, SiP faces a big challenge: the difficulty in determining whether memory devices are known good die (KGD) before assembly of the SiP. This can lead to poor manufacturing yields and increased costs. Thanks to Rambus innovations, available for licensing, technology such as SiPFLOW™ can address the KGD challenge achieving assembly yields of better than 100 defective parts per million devices (DPPM). That means designers can squeeze more performance into mobile phones at a price that consumers will like